Simcenter™ 3D Thermal Simulation

Thermal Simulation

Thermal management is of great importance for many different products, such as industrial machines, cars and consumer electronics. The purpose of this is to keep the product temperature optimal for the best possible performance. To do this, you may need to remove or add heat, either actively or passively, which you can evaluate using thermal simulation software. Simcenter™ 3D includes comprehensive, best in class thermal simulation capabilities that help you better understand the thermal properties of your product and then tailor your thermal solution for optimal performance.

Simulate complex
heat transfer

Better insight into
thermal management

Reduce
physical prototypes

Connections with
flow and structural

The advantages Thermal Simulation

Get more insight into the thermal management of your product
Reduce the number of physical prototypes and design risks
Simulate complex heat transfer situations where conduction, convection and radiation come together

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Heat transfer by conduction

Thermal conduction occurs when heat is transferred through a solid from areas of higher temperature to low temperature. This happens spontaneously and continues until thermal equilibrium is reached. Everyday examples of conduction are the handle of a hot pot of boiling water, the rise in temperature of the outer wall of a copper pipe when hot water passes through it, or the spontaneous cold you feel when you eat an ice cream. Understanding conductivity can help you design safer, more reliable and better performing products.

Heat transfer by convection

Convection is a common way of heat transfer that can be seen in various applications, processes and natural phenomena. Many products rely on free or forced convection for optimal performance and durability. Optimizing convection in these devices, both through strategic placement of components and through the use of another medium, is a complex problem. Simcenter™ 3D offers powerful capabilities for addressing convection in product design.

Heat transfer by radiation

Radiation occurs when objects radiate microwave energy. These microwaves, which are normally located in the infrared region of the wave spectrum, are known as heat radiation. Simcenter™ 3D offers you possibilities to solve the most complex problems related to radiant heat transfer.

Evaluate thermal stresses in structure

Thermal loads usually create stresses in components that contribute to the stresses resulting from other types of loads such as contact, force and pressure. Thermal stresses are caused by changes in temperature in a structure that prevents expansion or contraction. Simcenter™ 3D also offers possibilities for evaluating thermomechanical stress in structures.

Thermal model preparation

Model preparation can take up to 80% of the overall CAE process. Often this is the result of what many people see as tedious tasks, the clean-up and the preparation of the geometry. Simcenter™ 3D offers advanced model preparation capabilities, including surface wrapping techniques for obtaining fluid volumes and for meshing “Boundary Layers”.

cards PLM Solutions: driven by digitalization

Start from the core: in our opinion, a thorough intake process does not mean a one-size-fits-all. We take the time to really get to know you.
Partnership: we continue to challenge you on the content. Whether it concerns a strategic, tactical or operational issue.
Personal approach: every partner gets its own team of specialists from day one. They do everything to get the most out of your process.